MPC8358EVRAGDGA
vs
MPC8358CVRAGDDA
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-668
|
29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-668
|
Pin Count |
668
|
668
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A002
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
NXP
|
NXP
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66.67 MHz
|
66.67 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B668
|
S-PBGA-B668
|
JESD-609 Code |
e2
|
e2
|
Length |
29 mm
|
29 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
668
|
668
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
HBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.46 mm
|
2.46 mm
|
Speed |
400 MHz
|
400 MHz
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER
|
TIN SILVER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
29 mm
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MPC8358EVRAGDGA with alternatives
Compare MPC8358CVRAGDDA with alternatives