MPC8349VVAGDA
vs
MPC8347ECVVAJF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
LBGA,
LBGA, BGA672,34X34,40
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
Length
35 mm
35 mm
Low Power Mode
YES
YES
Number of Terminals
672
672
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.69 mm
1.69 mm
Speed
400 MHz
533 MHz
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
2
1
Rohs Code
Part Package Code
BGA
Pin Count
672
JESD-609 Code
e1
Moisture Sensitivity Level
3
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
BGA672,34X34,40
Peak Reflow Temperature (Cel)
260
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
40
Compare MPC8349VVAGDA with alternatives
Compare MPC8347ECVVAJF with alternatives