MPC8349EZUAGDB
vs
MPC8349CZUAJD
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Reach Compliance Code
unknown
unknown
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
2
Rohs Code
Package Description
35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Additional Feature
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B672
Length
35 mm
Low Power Mode
YES
Moisture Sensitivity Level
1
Number of Terminals
672
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA672,34X34,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Seated Height-Max
1.69 mm
Speed
533 MHz
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
35 mm
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