MPC8347VVAGFB
vs
KMPC8349EVVAJFB
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
LBGA, BGA672,34X34,40
35 X 35 MM, 1.50 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, TBGA-672
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
5A002
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B672
Length
35 mm
Low Power Mode
YES
Number of Terminals
672
Operating Temperature-Max
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA672,34X34,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Seated Height-Max
1.69 mm
Speed
400 MHz
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
672
Compare MPC8347VVAGFB with alternatives
Compare KMPC8349EVVAJFB with alternatives