MPC8347EZUADF
vs
MPC8347EZUADFB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
LBGA, BGA672,34X34,40
LBGA,
Pin Count
672
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Category CO2 Kg
12.2
Compliance Temperature Grade
Other: +0C to +105C
Candidate List Date
2015-12-17
Conflict Mineral Status
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
CMRT V3.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
JESD-609 Code
e0
Length
35 mm
35 mm
Low Power Mode
YES
YES
Number of Terminals
672
672
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA672,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.69 mm
1.69 mm
Speed
266 MHz
266 MHz
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
2
1
Additional Feature
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Compare MPC8347EZUADF with alternatives
Compare MPC8347EZUADFB with alternatives