MPC8347EVRADDB vs MPC8347EZQADF feature comparison

MPC8347EVRADDB Freescale Semiconductor

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MPC8347EZQADF NXP Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-620 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-620
Pin Count 620
Reach Compliance Code compliant unknown
ECCN Code 5A002 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B620 S-PBGA-B620
JESD-609 Code e2
Length 29 mm 29 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 620 620
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA620,28X28,40 BGA620,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.46 mm 2.46 mm
Speed 266 MHz 266 MHz
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 2

Compare MPC8347EVRADDB with alternatives

Compare MPC8347EZQADF with alternatives