MPC8347ECVRADDB
vs
MPC8343VRADDX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-620
BGA,
Reach Compliance Code
compliant
unknown
ECCN Code
5A002.A.1
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
52 Weeks
Samacsys Manufacturer
NXP
Additional Feature
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B620
S-PBGA-B620
JESD-609 Code
e2
Length
29 mm
29 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
620
620
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA620,28X28,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.46 mm
2.46 mm
Speed
266 MHz
266 MHz
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver (Sn/Ag)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
1
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