MPC8347CVVAGDB
vs
KMPC8347EZUAGDB
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-672
|
35 X 35 MM, 1.50 MM HEIGHT, 1 MM PITCH, TBGA-672
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
5A002
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
|
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
66 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B672
|
|
| JESD-609 Code |
e2
|
|
| Length |
35 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
672
|
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Equivalence Code |
BGA672,34X34,40
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.69 mm
|
|
| Speed |
400 MHz
|
|
| Supply Voltage-Max |
1.26 V
|
|
| Supply Voltage-Min |
1.14 V
|
|
| Supply Voltage-Nom |
1.2 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Silver (Sn/Ag)
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
35 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
672
|
|
|
|
Compare MPC8347CVVAGDB with alternatives
Compare KMPC8347EZUAGDB with alternatives