MPC8347CVVADD vs MPC8347EZUAJF feature comparison

MPC8347CVVADD NXP Semiconductors

Buy Now Datasheet

MPC8347EZUAJF Freescale Semiconductor

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description LBGA, 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 5A002
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e1 e0
Length 35 mm 35 mm
Low Power Mode YES YES
Number of Terminals 672 672
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.69 mm 1.69 mm
Speed 266 MHz 533 MHz
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 4
Rohs Code No
Part Package Code BGA
Pin Count 672
Moisture Sensitivity Level 3
Package Equivalence Code BGA672,34X34,40
Peak Reflow Temperature (Cel) 260
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) 40

Compare MPC8347CVVADD with alternatives

Compare MPC8347EZUAJF with alternatives