MPC8343CZQAGDA
vs
MPC8347ECZQAGF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-620
29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-620
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B620
S-PBGA-B620
Length
29 mm
29 mm
Low Power Mode
YES
YES
Number of Terminals
620
620
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.46 mm
2.46 mm
Speed
400 MHz
400 MHz
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
3
Rohs Code
JESD-609 Code
e0
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
BGA620,28X28,40
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Compare MPC8343CZQAGDA with alternatives
Compare MPC8347ECZQAGF with alternatives