MPC8323EZQAFDC
vs
MPC8321EZQAFDCA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
5A002
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
Address Bus Width
14
Boundary Scan
YES
YES
External Data Bus Width
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B516
S-PBGA-B516
Length
27 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
516
516
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY
Seated Height-Max
2.55 mm
2.55 mm
Speed
333 MHz
333 MHz
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
516
Bit Size
32
Clock Frequency-Max
66.67 MHz
Qualification Status
Not Qualified
Compare MPC8323EZQAFDC with alternatives
Compare MPC8321EZQAFDCA with alternatives