MPC8323CVRADDC
vs
MPC8323EVRADDC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
ROCHESTER ELECTRONICS INC
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-516
,
Pin Count
516
516
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
66.67 MHz
External Data Bus Width
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B516
JESD-609 Code
e1
e1
Length
27 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
3
Number of Terminals
516
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
HBGA
Package Equivalence Code
BGA516,26X26,40
Package Shape
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Seated Height-Max
2.55 mm
Speed
266 MHz
Supply Voltage-Max
1.05 V
Supply Voltage-Min
0.95 V
Supply Voltage-Nom
1 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Base Number Matches
1
3
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