Findchips: Compare MPC8313EVRAGD vs MPC8313CVRAGD

MPC8313EVRAGD vs MPC8313CVRAGD feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Active
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Package Description	HBGA,	27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516
Reach Compliance Code	unknown	compliant
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Additional Feature	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	66.67 MHz	66.67 MHz
External Data Bus Width	32	32
Format	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES
JESD-30 Code	S-PBGA-B516	S-PBGA-B516
JESD-609 Code	e1	e2
Length	27 mm	27 mm
Low Power Mode	YES	YES
Number of Terminals	516	516
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	HBGA	HBGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.55 mm	2.55 mm
Speed	400 MHz	400 MHz
Supply Voltage-Max	1.5 V	1.5 V
Supply Voltage-Min	0.95 V	0.95 V
Supply Voltage-Nom	1 V	1 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Finish	TIN SILVER COPPER	TIN SILVER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	27 mm	27 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR	MICROPROCESSOR
Base Number Matches	3	3
Rohs Code		Yes
Moisture Sensitivity Level		3
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors