MPC8308ZQADDA
vs
MPC8308CVMAGD
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
,
|
MAPBGA-473
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
NXP
|
|
JESD-609 Code |
e0
|
e2
|
Moisture Sensitivity Level |
3
|
3
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
473
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
66.67 MHz
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
YES
|
JESD-30 Code |
|
S-PBGA-B473
|
Length |
|
19 mm
|
Low Power Mode |
|
YES
|
Number of Serial I/Os |
|
2
|
Number of Terminals |
|
473
|
Operating Temperature-Max |
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LFBGA
|
Package Equivalence Code |
|
BGA473,23X23,32
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.54 mm
|
Speed |
|
400 MHz
|
Supply Voltage-Max |
|
1.05 V
|
Supply Voltage-Min |
|
0.95 V
|
Supply Voltage-Nom |
|
1 V
|
Surface Mount |
|
YES
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
19 mm
|
|
|
|
Compare MPC8308ZQADDA with alternatives
Compare MPC8308CVMAGD with alternatives