MPC8308ZQADDA
vs
MCIMX27MJP4A
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
,
|
19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
5A002.A
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| JESD-609 Code |
e0
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN SILVER COPPER OVER NICKEL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
SoC
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
473
|
| Additional Feature |
|
ALSO OPERATES 1.3V AT 266MHZ
|
| JESD-30 Code |
|
S-PBGA-B473
|
| Length |
|
19 mm
|
| Number of Terminals |
|
473
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFBGA
|
| Package Equivalence Code |
|
BGA473,23X23,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.54 mm
|
| Supply Voltage-Max |
|
1.52 V
|
| Supply Voltage-Min |
|
1.38 V
|
| Supply Voltage-Nom |
|
1.45 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
19 mm
|
|
|
|
Compare MPC8308ZQADDA with alternatives
Compare MCIMX27MJP4A with alternatives