MPC8308CZQAFD
vs
MCIMX31CVMN4C
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
19 X 19 MM, 0.80 MM PITCH, 1.39 MM HEIGHT, MAPBGA-473
|
MAPBGA-473
|
Pin Count |
473
|
473
|
Reach Compliance Code |
unknown
|
compliant
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
333 MHz
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B473
|
S-PBGA-B473
|
JESD-609 Code |
e0
|
|
Length |
19 mm
|
19 mm
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
473
|
473
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1.54 mm
|
1.54 mm
|
Speed |
266 MHz
|
|
Supply Voltage-Max |
1.05 V
|
1.47 V
|
Supply Voltage-Min |
0.95 V
|
1.22 V
|
Supply Voltage-Nom |
1 V
|
1.4 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER OVER NICKEL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
19 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
SoC
|
Base Number Matches |
2
|
2
|
ECCN Code |
|
5A002.A
|
HTS Code |
|
8542.31.00.01
|
Samacsys Manufacturer |
|
NXP
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Equivalence Code |
|
BGA473,23X23,32
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
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