MPC8308CVMADD
vs
MCIMX31CVMN4D
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
19 X 19 MM, 0.80 MM PITCH, 1.39 MM HEIGHT, LEAD FREE, MAPBGA-473
|
|
| Pin Count |
473
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
266 MHz
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B473
|
|
| JESD-609 Code |
e2
|
e1
|
| Length |
19 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
473
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
1.54 mm
|
|
| Speed |
266 MHz
|
|
| Supply Voltage-Max |
1.05 V
|
|
| Supply Voltage-Min |
0.95 V
|
|
| Supply Voltage-Nom |
1 V
|
|
| Surface Mount |
YES
|
|
| Terminal Finish |
TIN COPPER/TIN SILVER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
19 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
5A992.C
|
| HTS Code |
|
8542.31.00.01
|
| Factory Lead Time |
|
15 Weeks
|
| Bus Compatibility |
|
I2C; SPI; UART; USB
|
| Number of I/O Lines |
|
9
|
|
|
|
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