MPC8306VMABFCA vs MPC8306SCVMABDCA feature comparison

MPC8306VMABFCA Freescale Semiconductor

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MPC8306SCVMABDCA NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description LFBGA, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369
Pin Count 369
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66.67 MHz
External Data Bus Width
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B369 S-PBGA-B369
JESD-609 Code e1 e2
Length 19 mm 19 mm
Low Power Mode YES YES
Number of Terminals 369 369
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Seated Height-Max 1.61 mm 1.61 mm
Speed 133 MHz 133 MHz
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 19 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Rohs Code Yes
Moisture Sensitivity Level 3
Package Equivalence Code BGA369,23X23,32
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Supply Voltage-Max 1.05 V
Supply Voltage-Min 0.95 V
Time@Peak Reflow Temperature-Max (s) 40

Compare MPC8306VMABFCA with alternatives

Compare MPC8306SCVMABDCA with alternatives