MPC8306SVMABCA
vs
MPC8306SVMABDCA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
LFBGA,
19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369
Pin Count
369
369
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
33.33 MHz
66.67 MHz
External Data Bus Width
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B369
S-PBGA-B369
JESD-609 Code
e1
e2
Length
19 mm
19 mm
Low Power Mode
YES
YES
Number of Terminals
369
369
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Seated Height-Max
1.61 mm
1.61 mm
Speed
133 MHz
133 MHz
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Pbfree Code
Rohs Code
Moisture Sensitivity Level
3
Package Equivalence Code
BGA369,23X23,32
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
40
Compare MPC8306SVMABCA with alternatives
Compare MPC8306SVMABDCA with alternatives