MPC8306SCVMABDCA
vs
MPC8271CVRTMFX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-516
Pin Count
369
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.67 MHz
133 MHz
External Data Bus Width
64
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B369
S-PBGA-B516
JESD-609 Code
e2
Length
19 mm
27 mm
Low Power Mode
YES
NO
Moisture Sensitivity Level
3
Number of Terminals
369
516
Operating Temperature-Max
105 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
BGA
Package Equivalence Code
BGA369,23X23,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.61 mm
2.55 mm
Speed
133 MHz
400 MHz
Supply Voltage-Max
1.05 V
1.575 V
Supply Voltage-Min
0.95 V
1.425 V
Supply Voltage-Nom
1 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
19 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Compare MPC8306SCVMABDCA with alternatives
Compare MPC8271CVRTMFX with alternatives