MPC8280ZQFX
vs
MPC8280ZQMHBX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
27 X 27 MM, 2.25 MM, 1 MM PITCH, PLASTIC, BGA-516
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66.67 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B516
S-PBGA-B516
Length
27 mm
27 mm
Low Power Mode
NO
NO
Number of Terminals
516
516
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
2.55 mm
Speed
133 MHz
266 MHz
Supply Voltage-Max
1.6 V
1.6 V
Supply Voltage-Min
1.45 V
1.45 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Part Package Code
BGA
Pin Count
516
Temperature Grade
OTHER
Compare MPC8280ZQFX with alternatives
Compare MPC8280ZQMHBX with alternatives