MPC8280ZQFX
vs
MPC8250ACVRPIBX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
BGA,
BGA,
Pin Count
516
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B516
S-PBGA-B516
Length
27 mm
27 mm
Low Power Mode
NO
NO
Number of Terminals
516
516
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
2.55 mm
Speed
133 MHz
300 MHz
Supply Voltage-Max
1.6 V
2.2 V
Supply Voltage-Min
1.45 V
1.9 V
Supply Voltage-Nom
1.5 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
ECCN Code
3A991.A.2
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Clock Frequency-Max
66.66 MHz
Operating Temperature-Max
70 °C
Operating Temperature-Min
Temperature Grade
COMMERCIAL
Compare MPC8280ZQFX with alternatives
Compare MPC8250ACVRPIBX with alternatives