MPC8280VRQLDX vs MPC8250ACVRIHBC feature comparison

MPC8280VRQLDX NXP Semiconductors

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MPC8250ACVRIHBC Rochester Electronics LLC

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Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-516 27 X 27 MM, PLASTIC, BGA-516
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
Length 27 mm 27 mm
Low Power Mode NO
Number of Terminals 516 516
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 2.55 mm 2.55 mm
Speed 333 MHz 200 MHz
Supply Voltage-Max 1.6 V 1.9 V
Supply Voltage-Min 1.45 V 1.7 V
Supply Voltage-Nom 1.5 V 1.8 V
Surface Mount YES YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 5
Pbfree Code Yes
Part Package Code BGA
Pin Count 516
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

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