MPC8275ZQQLDX
vs
MPC8323CZQADDCA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
83.33 MHz
66.67 MHz
External Data Bus Width
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B516
S-PBGA-B516
Length
27 mm
27 mm
Low Power Mode
NO
YES
Number of Terminals
516
516
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
2.55 mm
Speed
333 MHz
266 MHz
Supply Voltage-Max
1.6 V
1.05 V
Supply Voltage-Min
1.45 V
0.95 V
Supply Voltage-Nom
1.5 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
516
JESD-609 Code
e0
Terminal Finish
TIN LEAD SILVER
Compare MPC8275ZQQLDX with alternatives
Compare MPC8323CZQADDCA with alternatives