MPC8270ZUSLDX
vs
MPC8260AZUPIBB
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
LBGA,
|
37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
83.33 MHz
|
66.66 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B480
|
S-PBGA-B480
|
Length |
37.5 mm
|
37.5 mm
|
Low Power Mode |
NO
|
NO
|
Number of Terminals |
480
|
480
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.65 mm
|
1.65 mm
|
Speed |
375 MHz
|
300 MHz
|
Supply Voltage-Max |
1.6 V
|
2.2 V
|
Supply Voltage-Min |
1.45 V
|
1.9 V
|
Supply Voltage-Nom |
1.5 V
|
2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
37.5 mm
|
37.5 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Factory Lead Time |
|
4 Weeks
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
220
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MPC8270ZUSLDX with alternatives
Compare MPC8260AZUPIBB with alternatives