MPC8270CVVQLDA
vs
MPC8255AZULHDX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, FTBGA-480
LBGA,
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
83.33 MHz
83.33 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B480
S-PBGA-B480
JESD-609 Code
e1
Length
37.5 mm
37.5 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
4
Number of Terminals
480
480
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA480,29X29,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
1.65 mm
Speed
333 MHz
250 MHz
Supply Voltage-Max
1.6 V
2.2 V
Supply Voltage-Min
1.45 V
1.9 V
Supply Voltage-Nom
1.5 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
37.5 mm
37.5 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Operating Temperature-Max
105 °C
Operating Temperature-Min
Compare MPC8270CVVQLDA with alternatives
Compare MPC8255AZULHDX with alternatives