MPC8266ACZULHDX vs MPC8270ZUQLDA feature comparison

MPC8266ACZULHDX Motorola Mobility LLC

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MPC8270ZUQLDA NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description LBGA, LBGA, BGA480,29X29,50
Pin Count 480
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 83.33 MHz 83.33 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B480 S-PBGA-B480
Length 37.5 mm 37.5 mm
Low Power Mode NO NO
Number of Terminals 480 480
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 1.65 mm
Speed 250 MHz 333 MHz
Supply Voltage-Max 2.1 V 1.6 V
Supply Voltage-Min 1.9 V 1.45 V
Supply Voltage-Nom 2 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 37.5 mm 37.5 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code No
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Equivalence Code BGA480,29X29,50
Peak Reflow Temperature (Cel) 260
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Time@Peak Reflow Temperature-Max (s) 40

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Compare MPC8270ZUQLDA with alternatives