MPC8260AZUPIBB
vs
MPC8266ACZUPIBX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480
LBGA,
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.66 MHz
66.66 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B480
S-PBGA-B480
JESD-609 Code
e0
Length
37.5 mm
37.5 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
3
Number of Terminals
480
480
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
1.65 mm
Speed
300 MHz
300 MHz
Supply Voltage-Max
2.2 V
2.1 V
Supply Voltage-Min
1.9 V
1.9 V
Supply Voltage-Nom
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
37.5 mm
37.5 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
4
4
Compare MPC8260AZUPIBB with alternatives
Compare MPC8266ACZUPIBX with alternatives