MPC8260AVVPJDB
vs
XPC8260AZUPJDA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
TBGA-480
37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.A.2
5A991
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Boundary Scan
YES
YES
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B480
S-PBGA-B480
JESD-609 Code
e1
e0
Length
37.5 mm
37.5 mm
Low Power Mode
YES
NO
Moisture Sensitivity Level
3
3
Number of Terminals
480
480
Operating Temperature-Max
105 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
220
Seated Height-Max
1.65 mm
1.65 mm
Speed
300 MHz
300 MHz
Supply Voltage-Max
2.7 V
2.2 V
Supply Voltage-Min
2.4 V
1.9 V
Supply Voltage-Nom
2.5 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
37.5 mm
37.5 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Part Package Code
BGA
Pin Count
480
Bit Size
32
Clock Frequency-Max
83.33 MHz
Qualification Status
Not Qualified
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