MPC8260ACZUMIBX vs MPC8255AVVMHBB feature comparison

MPC8260ACZUMIBX NXP Semiconductors

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MPC8255AVVMHBB NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description LBGA, 37.50 X 37.50 MM, 1.55 MM HEIGHT, , 1.27 MM PITCH, LEAD FREE, TBGA-480
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz 66.66 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B480 S-PBGA-B480
Length 37.5 mm 37.5 mm
Low Power Mode NO NO
Number of Terminals 480 480
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified
Seated Height-Max 1.65 mm 1.65 mm
Speed 266 MHz 266 MHz
Supply Voltage-Max 2.2 V 2.2 V
Supply Voltage-Min 1.9 V 1.9 V
Supply Voltage-Nom 2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 37.5 mm 37.5 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code Yes
Factory Lead Time 2 Days
Samacsys Manufacturer NXP
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 105 °C
Operating Temperature-Min
Peak Reflow Temperature (Cel) 260
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) 40

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Compare MPC8255AVVMHBB with alternatives