MPC8260ACVVMIBB
vs
MPC8265ACZUMIBC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Package Description
LBGA,
37.5 X 37.5 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, TBGA-480
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Boundary Scan
YES
YES
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B480
S-PBGA-B480
JESD-609 Code
e1
Length
37.5 mm
37.5 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
480
480
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Seated Height-Max
1.65 mm
1.65 mm
Speed
266 MHz
266 MHz
Supply Voltage-Max
2.7 V
2.1 V
Supply Voltage-Min
2.4 V
1.9 V
Supply Voltage-Nom
2.5 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
37.5 mm
37.5 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
4
Bit Size
32
Clock Frequency-Max
66.66 MHz
Qualification Status
Not Qualified
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