MPC8255AZUMHBB
vs
MPC8255ACVVMHBB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Package Description
LBGA,
TBGA-480
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.66 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B480
S-PBGA-B480
Length
37.5 mm
37.5 mm
Number of Terminals
480
480
Operating Temperature-Max
70 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Seated Height-Max
1.65 mm
1.65 mm
Speed
266 MHz
266 MHz
Supply Voltage-Max
2.1 V
2.7 V
Supply Voltage-Min
1.9 V
2.4 V
Supply Voltage-Nom
2 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
37.5 mm
37.5 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
4
2
Rohs Code
Samacsys Manufacturer
NXP
JESD-609 Code
e1
Low Power Mode
YES
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
40
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