MPC8255ACVVMHBB
vs
MPC8255AVVMHBB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
TBGA-480
|
37.50 X 37.50 MM, 1.55 MM HEIGHT, , 1.27 MM PITCH, LEAD FREE, TBGA-480
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Address Bus Width |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B480
|
S-PBGA-B480
|
| JESD-609 Code |
e1
|
e1
|
| Length |
37.5 mm
|
37.5 mm
|
| Low Power Mode |
YES
|
NO
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
480
|
480
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.65 mm
|
1.65 mm
|
| Speed |
266 MHz
|
266 MHz
|
| Supply Voltage-Max |
2.7 V
|
2.2 V
|
| Supply Voltage-Min |
2.4 V
|
1.9 V
|
| Supply Voltage-Nom |
2.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
37.5 mm
|
37.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
4 Weeks
|
| Bit Size |
|
32
|
| Clock Frequency-Max |
|
66.66 MHz
|
|
|
|
Compare MPC8255ACVVMHBB with alternatives
Compare MPC8255AVVMHBB with alternatives