MPC8250AZUPIBC
vs
MPC8270VVPKBX
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
37 X 37 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, TBGA-480
|
LBGA,
|
| Pin Count |
480
|
480
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
REQUIRES 3.3V SUPPLY FOR I/O
|
ALSO REQUIRES 3.3V SUPPLY
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B480
|
S-PBGA-B480
|
| JESD-609 Code |
e0
|
|
| Length |
37.5 mm
|
37.5 mm
|
| Low Power Mode |
NO
|
NO
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
480
|
480
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
220
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
1.65 mm
|
1.65 mm
|
| Speed |
300 MHz
|
300 MHz
|
| Supply Voltage-Max |
2.2 V
|
1.6 V
|
| Supply Voltage-Min |
1.9 V
|
1.45 V
|
| Supply Voltage-Nom |
2 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
37.5 mm
|
37.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
5
|
2
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Clock Frequency-Max |
|
66.67 MHz
|
| Technology |
|
CMOS
|
|
|
|
Compare MPC8270VVPKBX with alternatives