MPC8250AVVMHBC
vs
MPC8250ACZUMHBC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-480
37 X 37 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, TBGA-480
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
NXP
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B480
S-PBGA-B480
JESD-609 Code
e1
Length
37.5 mm
37.5 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
3
3
Number of Terminals
480
480
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
220
Seated Height-Max
1.65 mm
1.65 mm
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
37.5 mm
37.5 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Additional Feature
REQUIRES 3.3V SUPPLY FOR I/O
Qualification Status
Not Qualified
Speed
266 MHz
Supply Voltage-Max
2.2 V
Supply Voltage-Min
1.9 V
Supply Voltage-Nom
2 V
Compare MPC8250AVVMHBC with alternatives
Compare MPC8250ACZUMHBC with alternatives