MPC8250ACVRPIBX
vs
MPC8323ECVRADDC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
BGA,
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-516
Pin Count
516
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
5A002
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
14
Bit Size
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.66 MHz
External Data Bus Width
64
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B516
S-PBGA-B516
Length
27 mm
27 mm
Low Power Mode
NO
YES
Number of Terminals
516
516
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Qualification Status
Not Qualified
Seated Height-Max
2.55 mm
2.55 mm
Speed
300 MHz
266 MHz
Supply Voltage-Max
2.2 V
1.05 V
Supply Voltage-Min
1.9 V
0.95 V
Supply Voltage-Nom
2 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Factory Lead Time
4 Weeks
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare MPC8250ACVRPIBX with alternatives
Compare MPC8323ECVRADDC with alternatives