MPC8245TZU350D
vs
KMPC8245LZU350D
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA, BGA352,26X26,50
|
35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
|
| Pin Count |
352
|
352
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
66 MHz
|
66 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
| Length |
35 mm
|
35 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
352
|
352
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA352,26X26,50
|
BGA352,26X26,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
220
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.65 mm
|
1.65 mm
|
| Speed |
350 MHz
|
350 MHz
|
| Supply Voltage-Max |
2.1 V
|
2.1 V
|
| Supply Voltage-Min |
1.9 V
|
1.9 V
|
| Supply Voltage-Nom |
2 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
35 mm
|
35 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
5
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare MPC8245TZU350D with alternatives
Compare KMPC8245LZU350D with alternatives