MPC8245TZU300D
vs
MPC8245LVV333D
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
LBGA, BGA352,26X26,50
35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352
Pin Count
352
352
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO OPERATES AT 2V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
Length
35 mm
35 mm
Low Power Mode
YES
YES
Number of Terminals
352
352
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA352,26X26,50
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
1.65 mm
Speed
300 MHz
333 MHz
Supply Voltage-Max
1.9 V
2.2 V
Supply Voltage-Min
1.7 V
1.9 V
Supply Voltage-Nom
1.8 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
35 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
4
5
Pbfree Code
Yes
Rohs Code
Yes
JESD-609 Code
e1
Moisture Sensitivity Level
3
Operating Temperature-Max
105 °C
Operating Temperature-Min
Temperature Grade
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Compare MPC8245TZU300D with alternatives
Compare MPC8245LVV333D with alternatives