MPC8245RZU400D
vs
XPC8240LVV200E
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
4
|
5
|
Rohs Code |
|
No
|
Package Description |
|
35 X 35 MM, 1.27 MM PITCH, LEAD FREE, TBGA-352
|
ECCN Code |
|
3A991.A.2
|
Address Bus Width |
|
32
|
Bit Size |
|
32
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
66 MHz
|
External Data Bus Width |
|
32
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
YES
|
JESD-30 Code |
|
S-PBGA-B352
|
JESD-609 Code |
|
e0
|
Length |
|
35 mm
|
Low Power Mode |
|
YES
|
Number of Terminals |
|
352
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LBGA
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.65 mm
|
Speed |
|
200 MHz
|
Supply Voltage-Max |
|
2.625 V
|
Supply Voltage-Min |
|
2.375 V
|
Supply Voltage-Nom |
|
2.5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
35 mm
|
|
|
|