MPC8245LZU300B
vs
MCF5485CZP200
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
LBGA, BGA352,26X26,50
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
Pin Count
352
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
5A002.A.1
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO OPERATES AT 2V SUPPLY
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66.67 MHz
External Data Bus Width
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B388
Length
35 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
352
388
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
2.55 mm
Speed
300 MHz
200 MHz
Supply Voltage-Max
1.9 V
3.6 V
Supply Voltage-Min
1.7 V
3 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Rohs Code
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e0
Moisture Sensitivity Level
3
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Peak Reflow Temperature (Cel)
260
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
40
Compare MPC8245LZU300B with alternatives
Compare MCF5485CZP200 with alternatives