MPC8245LZU266X
vs
XPC8245LZU266LB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
BGA
Package Description
LBGA,
BGA, BGA352,26X26,50
Pin Count
352
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
Length
35 mm
Low Power Mode
YES
Number of Terminals
352
352
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
Speed
266 MHz
266 MHz
Supply Voltage-Max
1.9 V
Supply Voltage-Min
1.7 V
Supply Voltage-Nom
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
3
Package Equivalence Code
BGA352,26X26,50
Power Supplies
1.8,3.3 V
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