MPC8245LZU266B vs XPC8245TZU266D feature comparison

MPC8245LZU266B Freescale Semiconductor

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XPC8245TZU266D Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description BGA, BGA352,26X26,50 LBGA,
Reach Compliance Code unknown unknown
Bit Size 32 32
JESD-30 Code S-PBGA-B352 S-PBGA-B352
Number of Terminals 352 352
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Power Supplies 2,3.3 V
Qualification Status Not Qualified Not Qualified
Speed 266 MHz 266 MHz
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 2
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO OPERATES AT 2V SUPPLY
Address Bus Width 32
Boundary Scan YES
Clock Frequency-Max 66 MHz
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Length 35 mm
Low Power Mode YES
Seated Height-Max 1.65 mm
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Supply Voltage-Nom 1.8 V
Width 35 mm

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