MPC8245LVV266D
vs
XPC8245TZU300D
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352
|
LBGA,
|
Pin Count |
352
|
352
|
Reach Compliance Code |
unknown
|
unknown
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66 MHz
|
66 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
JESD-609 Code |
e1
|
|
Length |
35 mm
|
35 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
352
|
352
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1.65 mm
|
1.65 mm
|
Speed |
266 MHz
|
300 MHz
|
Supply Voltage-Max |
2.1 V
|
1.9 V
|
Supply Voltage-Min |
1.7 V
|
1.7 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
35 mm
|
35 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
5
|
2
|
ECCN Code |
|
3A991.A.2
|
HTS Code |
|
8542.31.00.01
|
Additional Feature |
|
ALSO OPERATES AT 2V SUPPLY
|
|
|
|
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