MPC755CPX400LE vs PCX755BMZFU400LE feature comparison

MPC755CPX400LE Freescale Semiconductor

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PCX755BMZFU400LE Thales Group

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC THOMSON-CSF SEMICONDUCTORS
Part Package Code BGA BGA
Package Description 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 ,
Pin Count 360 360
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.1 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY 400 MHZ TO BE CONFIRMED
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 100 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B360 S-PBGA-B360
JESD-609 Code e0
Length 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 360 360
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.77 mm
Speed 400 MHz 400 MHz
Supply Voltage-Max 2.1 V 2.1 V
Supply Voltage-Min 1.9 V 1.9 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 4 2
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Temperature Grade MILITARY

Compare MPC755CPX400LE with alternatives

Compare PCX755BMZFU400LE with alternatives