MPC7410VS450LE
vs
PC7410VGSU450LE
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
E2V TECHNOLOGIES PLC
Part Package Code
LGA
BGA
Package Description
25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, LGA-360
BGA, CGA360,19X19,50
Pin Count
360
360
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
133 MHz
133 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B360
S-CBGA-B360
Length
25 mm
25 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
Number of Terminals
360
360
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
HBGA
BGA
Package Equivalence Code
LGA360,19X19,50
CGA360,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
4.2 mm
Speed
450 MHz
450 MHz
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Compare MPC7410VS450LE with alternatives
Compare PC7410VGSU450LE with alternatives