MPC7410RX500LE
vs
TSXPC750AMG8LE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Ihs Manufacturer
MOTOROLA INC
Part Package Code
BGA
Package Description
BGA,
Pin Count
360
Reach Compliance Code
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
133 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-CBGA-B360
Length
25 mm
Low Power Mode
YES
Number of Terminals
360
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
3.2 mm
Speed
500 MHz
Supply Voltage-Max
1.9 V
Supply Voltage-Min
1.7 V
Supply Voltage-Nom
1.8 V
Surface Mount
YES
Technology
CMOS
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Base Number Matches
1
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