MPC603RFE133LC
vs
TSXPC603RVDS8LX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
ATMEL CORP
Part Package Code
QFP
QFP
Package Description
FQFP,
HFQFP,
Pin Count
240
240
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
YES
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CQFP-G240
S-PQFP-G240
Length
31.305 mm
32 mm
Low Power Mode
YES
YES
Number of Terminals
240
240
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
FQFP
HFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
FLATPACK, HEAT SINK/SLUG, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.15 mm
4.1 mm
Speed
133 MHz
200 MHz
Supply Voltage-Nom
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
31.305 mm
32 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
1
ECCN Code
3A991.A.2
Clock Frequency-Max
75 MHz
Operating Temperature-Max
80 °C
Operating Temperature-Min
-40 °C
Supply Voltage-Max
2.625 V
Supply Voltage-Min
2.375 V
Temperature Grade
OTHER
Compare MPC603RFE133LC with alternatives
Compare TSXPC603RVDS8LX with alternatives