MPC603AFE80CB
vs
TSPC603EVAB/T2MN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
ATMEL CORP
Part Package Code
QFP
QFP
Package Description
FQFP,
FQFP,
Pin Count
240
240
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
80 MHz
66.67 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
NO
YES
JESD-30 Code
S-GQFP-G240
S-CQFP-G240
Length
31.305 mm
31 mm
Low Power Mode
YES
YES
Number of DMA Channels
Number of External Interrupts
2
Number of Serial I/Os
Number of Terminals
240
240
On Chip Data RAM Width
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
FQFP
FQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
FLATPACK, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
4.15 mm
4.15 mm
Speed
80 MHz
80 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
31.305 mm
31 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Operating Temperature-Max
110 °C
Operating Temperature-Min
-40 °C
Screening Level
MIL-STD-883
Compare MPC603AFE80CB with alternatives
Compare TSPC603EVAB/T2MN with alternatives