MPC566AZP56 vs MPC566AZP56 feature comparison

MPC566AZP56 Motorola Mobility LLC

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MPC566AZP56 NXP Semiconductors

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Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, 27 X 27 MM, 2.55 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-388
Pin Count 388
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature ALSO REQUIRES 5V SUPPLY ALSO REQUIRES 5V SUPPLY
Address Bus Width 24 24
Bit Size 32 32
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B388 S-PBGA-B388
Length 27 mm 27 mm
Number of Terminals 388 388
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 2.55 mm 2.55 mm
Speed 56 MHz 56 MHz
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.5 V 2.5 V
Supply Voltage-Nom 2.6 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Rohs Code No
Samacsys Manufacturer NXP
Boundary Scan NO
JESD-609 Code e0
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Package Equivalence Code BGA388,26X26,40
Peak Reflow Temperature (Cel) 240
RAM (bytes) 36864
ROM (words) 1048576
Supply Current-Max 120 mA
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

Compare MPC566AZP56 with alternatives

Compare MPC566AZP56 with alternatives