MPC565CZP40 vs MPC565CZP40 feature comparison

MPC565CZP40 Motorola Mobility LLC

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MPC565CZP40 NXP Semiconductors

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Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388
Pin Count 388
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Additional Feature ALSO REQUIRES 5V SUPPLY ALSO REQUIRES 5V SUPPLY
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 84 MHz 84 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B388 S-PBGA-B388
Length 27 mm 27 mm
Number of I/O Lines
Number of Terminals 388 388
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 2.55 mm 2.55 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.5 V 2.6 V
Supply Voltage-Nom 2.6 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 1
Rohs Code No
Factory Lead Time 16 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e0
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Package Equivalence Code BGA388,26X26,40
Peak Reflow Temperature (Cel) 240
RAM (bytes) 36864
ROM (words) 1048576
Supply Current-Max 120 mA
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

Compare MPC565CZP40 with alternatives

Compare MPC565CZP40 with alternatives